Можно ли вернуть к жизни ?kingston 32 gb

WHAT IS THIS?
WE NEED LIKE THIS
Description: [I:]USB Mass Storage Device(USB DISK 2.0)
Device Type: Mass Storage Device

Protocal Version: USB 2.00
Current Speed: High Speed
Max Current: 300mA

USB Device ID: VID = 13FE PID = 3800
Serial Number: 901606008AD10006

Device Name: USB DISK 2.0
Device Revision: 0100

Product Model: USB DISK 2.0
Product Revision: PMAP

Controller Vendor: Phison
Controller Part-Number: PS2251-38(PS2238) — F/W 02.06.10 [2011-01-27]
Flash ID code: 98DE95327A55 — Toshiba TH58NVG8D2ELA89 [MLC-8K]

Tools on web: dl.mydigit.net/special/up/phison.html

Possible Flash Part-Number
— [4CE]TH58NVG8D2ELA89(43nm)

Flash ID mapping table
— [Channel 0] [Channel 1]

ALSO TAKE PICTURE FROM BOARD PCB

Добавил информацию в пост. из программы USB Flash Info

ChipGenius выдает следующее:

Description: [D:]Запоминающее устройство для USB(2307 PRAM)
Device Type:  Mass Storage Device
Protocal Version: USB 3.00
Current Speed: High Speed
Max Current: 96mA
USB Device ID: VID = 13FE PID = 5500
Device Vendor: Phison
Device Name: 2307 Boot ROM
Device Revision: 0110
Product Model: 2307 PRAM
Product Revision: 1.00
Controller Vendor: Phison
Controller Part-Number: PS2251-07(PS2307) - F/W 01.05.10 [2015-04-24]
Flash ID code:      F3F3F3F3F3F3 []
Possible Flash Part-Number
----------------------------
Flash ID mapping table
----------------------------
[Channel 0]	[Channel 1]

f3 f3 f3 f3 ????????

nand data io is not ok ?!!!
re solder nand pin

kingston use glue .remove glue by bensin or tener. re dolder nand all pin

your nand must be 983a98a3 *2 or 983a9493
The manufacturer is an idiot
and uses glue
Over time, the glue will cut off the flash from the solder
Put it in a container of gasoline and thinner for a day until the glue disappears
Then re-solder with good soldering flux

Получилось решить проблему?