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Davod

I HAVE 5.1.50 YOUR FIRMWARE 8.3.50 .I PUT DOWNLOAD LINK

MP INI LIKE THAT
[ParamEdit]
version= V3.12.5.0
[PenDriveMP]
IC Type=PS2251-07
[Parameter Mark]
Parameter Type=F1_MP_21
[Customize Info]
USB VID=0x13FE
USB PID=0x5500
String Product Name=USB DISK 3.0
Inquiry Version=PMAP
[Configuration]
Reset Serial Number=0
[TestItemOption]
Do Preformat Test=1
[Extra]
Mode=3
[Misc]
Volume Label=USB DISK
Burner Erase All=1
[Advance]
FC1=0xff
FC2=0x01
CheckUSBConnectorType=0x22
[Firmware]
ISP=1
Burner File=BN07V500T9.BIN
Firmware Name=FW07V050150MICRONB95ANDHYNIXTLC .BIN
Chip Part-Number: PS2251-07(PS2307) — F/W 08.03.50 [2018-05-11]
Flash ID Code: AD3A1803 — Hynix [TLC]
USE MPALL 5.3.B FIRMWRE
drive.google.com/file/d/1vdDr7FvmFxVZ-w1UwunLaFmzz05rDoNz/view?usp=drive_link
no tool for this controller
take picture of usb 2 side complete
RM1135_HynixV6_4Lun_ZD1N3G5K_ZD0R3G5K_SSDMP2.58.0.0_20220701

first check badblock as RDT OR NOT
jp2

your nand maybe hynix v6 .i uploaded to flashboot.ru
you must download 2259xt easy tool
I CANT UPLOAD FILE (I)MPToolsV1.8.8.6.367_191111 WHY ?I DONT KNOW
AFTER FLASH REPORT

IF YOUR NAND IS 2D I RECOMEND IS917
BUT YOUR NAND IS BICS3
i think bics4 or bics3 453E99B37672
yes why not? whats your nand id?
your nand must be 983a98a3 *2 or 983a9493
The manufacturer is an idiot
and uses glue
Over time, the glue will cut off the flash from the solder
Put it in a container of gasoline and thinner for a day until the glue disappears
Then re-solder with good soldering flux
kingston use glue .remove glue by bensin or tener. re dolder nand all pin
f3 f3 f3 f3 ????????

nand data io is not ok ?!!!
re solder nand pin